NVIDIA® Jetson Orin NX / Orin Nano Fanless Panel PC
• NVIDIA® Jetson Orin™ NX 16GB
(1024 CUDA cores + 8-core ARM Cortex-A78AE CPU + 16 GB LPDDR5)
• NVIDIA® Jetson Orin™ NX 8GB
(1024 CUDA cores + 6-core ARM Cortex-A78AE CPU + 8 GB LPDDR5)
• NVIDIA® Jetson Orin™ Nano 8GB
(1024 CUDA cores + 6-core ARM Cortex-A78AE CPU + 8 GB LPDDR5)
Platform Security Controller (PSC), Security Engine (SE)
10.1″
1280 x 800
1000 nits
800:1
178/178
50000
PCT w/ AG and AF treatment
Optical Bonding
1 x Line-out, 1 x Mic-in (optional)
• 1 x 2.5 GbE (Optional 4 x PoE+ for PoE model)
• 1 x GbE via M12 X-code
4 x GMSL-2 via FAKRA (for GMSL Model)
1 x CAN FD via M8
2 x USB 2.0 via M8
3 x DI (DC 60 V) + 4 x DO (12VDC/100mA)
• 1 x RS-232/422/485 via M8
• 1 x RS-232 via M8
1 x USB Type-C (device only)
CE, FCC Class A, UKCA, E-Mark
• 1 x M.2 3042/3052 Key B for WWAN w/ Nano SIM support
• 1 x M.2 2230 Key E for Wi-Fi/BT
1 x M.2 2242 Key M for NVMe SSD (Pre-installed system BSP)
DC 9-60V (nominial power input DC 12V/24V/48V)
OCP, OVP, surge protection, reversed polarity protection
Ignition detection
Removable top tray for RTC coin cell battery
NVIDIA® JetPack 6.2 or above
(Jetson Linux and NVIDIA® development tools included)
-25°C ~ 60°C (-13°F ~ 140°F) with 0.6 m/s airflow
-40°C ~ 85°C (-40°F ~ 185°F)
10% RH ~ 95% RH (non-condensing)
• IEC 60068-2-64, random, 2.5G@5~500Hz, 1hr/axis
• MIL-STD-810H, Method 514.8, Procedure I, Category 4
MIL-STD-810H, Method 516.8, Procedure I, trucks and semi-trailers=15G (11ms)
6 x SMA connector mounting hole
VESA 100 x 100
4.15 kg (9.15 lb)
260 x 179 x 75 (10.24 x 7.05 x 2.96 in.)
IP66
VPC-101RB2S-OB-(P/G2)-(ONX16/ONX8/ON8)
(P=with PoE+, G2=with GMSL, None=w/o function board)
Jetson Platfom:
ONX16= Jetson Orin 16GB
ONX8= Jetson Orin 8GB
ON8= Jetson Orin Nano 8GB
Made in Taiwan
M.2 2242 Key M NVMe SSD 240G/256G/480G/512G/960G, -40°C ~ 85°C
M.2 2230 Key A-E Wi-Fi module, -40°C ~ 85°C
M.2 3042/3052 Key B WWAN module w/ thermal kit, -40°C ~ 85°C
M.2 2242 Key B GNSS module, -40°C ~ 85°C
